Resolving 2 and 3 mil lines and spaces is one of the biggest challenges facing the PCB Manufacturing Industry. Equipment and Processes developed in the late 60's and early 70's, to resolve .010" features are still being used to produce today's fine line circuits. To meet this challenge, there have been a number of equipment developments as well as many technical papers written that are now available to see online.

The Hakuto Film Lamination equipment is one of the leading systems supporting fine line resolution.

When it comes to overall expertise, Karl Dietz of DuPont has written many articles and technical bulletins to highlight the best practises for fine lines. Karl's papers can be found on the DuPont web site and in several publications of CircuiTree Magazine and PCB007.