Matrix Plus HF Coverlay and Bond-ply

The The Matrix Plus HF Coverlay and Bond-Ply composites use a specialty halogen free, flame retardant, high temperature modified epoxy adhesive coated on high quality polyimide films.
These materials are designed for flex circuit applications where soldering and high temperature resistance are key.

These materials are manufactured in North America under rigid quality specification*.

For more info, contact

Robert Berg

Robert Berg

Office (408) 477-2963 ext.3313


Flex Rolls

Benefits

  • Excellent dielectric performance with high bond strength and good dimensional stability
  • Certified to IPC 4203 /2/19
  • Fire Retardant – UL94 VTM-0
  • Manufactured under ISO 9001-2008, 16949, and 14000 standards
  • RoHS compliant
  • Consistent and predictable adhesive flow and fill
  • Universal compatibility with polyimide dielectric films
  • Industry standard lamination and processing parameters
  • Supported by large local inventory stocks

Product Line

COVERLAY
Plus HF Adhesive Polyimide Adhesive
mil µm mil µm mil µm
MCL Plus HF .550 0.7 17.5 0.5 12.5 0 0
MCL Plus HF 1.50 1 25 0.5 12.5 0 0
MCL Plus HF 110 1 25 1 25 0 0
MCL Plus HF 210 2 50 1 25 0 0
MCL Plus HF 120 1 25 2 50 0 0
MCL Plus HF 130 1 25 3 75 0 0
MCL Plus HF 250 2 50 5 125 0 0
BOND-PLY
Plus HF Adhesive Polyimide Adhesive
mil µm mil µm mil µm
MBP Plus HF 111 1 25 1 25 1 25
MBP Plus HF 121 1 25 2 50 1 25
MBP Plus HF 212 2 50 1 25 2 50
ADHESIVE-PLY
Plus FR Adhesive Polyimide Adhesive
mil µm mil µm mil µm
MAP Plus HF 100 1 25 0 0 0 0
MAP Plus HF 200 2 50 0 0 0 0

Resources


* Manufactured for Matrix by Sheldahl, a Multek brand